Heterogeneous Integration Global Summit 2026 – Day 3

As the economic benefits of advanced node scaling become increasingly challenging to achieve through front-end semiconductor technologies alone, heterogeneous integration has emerged as one of the most effective enablers of the "More-than-Moore" era. Advanced packaging technologies are now playing a critical role in delivering the performance, bandwidth, power efficiency, and system-level integration required for AI applications.

To help attendees gain a comprehensive understanding of the AI Packaging Supply Chain Ecosystem, this session will explore a broad range of differentiated driving technologies, covering industry trends, process flows, manufacturing challenges, and emerging ecosystem solutions.

Topics Coverage: 
1. AI Supply Chain Ecosystem for Robotics Applications
Service Robots (服務型機器人)
Industrial Robots (工業型機器人)

2. Packaging Technologies for Silicon Photonics (SiPH) and Co-Packaged Optics (CPO)
Si Photonics integration challenges and opportunities
CPO architecture, packaging processes, and reliability considerations

3. Packaging Technologies for C2W/W2W Hybrid Bonding
Chip-to-Wafer (C2W) Hybrid Bonding
Wafer-to-Wafer (W2W) Hybrid Bonding

4. Packaging Technologies for Advanced Heterogeneous Integration
CoPoS (Chip-on-Panel-on-Substrate) / FO-PLP (Fan-Out Panel Level Packaging)
Advanced Substrate Technologies (TGV: Through-Glass Via)