Accelerating Hybrid Bonding Solutions through Customer and Integration Co-Optimization
As the semiconductor industry continues to push the boundaries of performance, power efficiency, and system integration, advanced packaging has become a critical enabler for 3D chiplet architectures in both logic and memory. In this context, hybrid bonding is emerging as a key technology, driven by the ongoing scaling of metal pitch and increasing thermal management challenges.
This presentation introduces a methodology to accelerate the development of hybrid bonding solutions through a Customer and Integration Co-Optimization Method (CI-COM). The approach emphasizes close collaboration between equipment suppliers and customers, with a focus on co-optimizing process integration using advanced deposition and etch capabilities. Several case examples will be presented to illustrate how this method enhances bonding strength, improves thermal dissipation in chiplet-based systems, and shortens process development cycle time. These improvements translate into measurable benefits across signal integrity, thermal performance, mechanical reliability, and overall system-level efficiency.
Key Technologies Covered
- Advanced packaging thin fil deposition
- Cu Electro-plating deposition
- TSV etch
- High Kappa film deposition
- Hybrid bonding in advanced packaging
- Customer and integration Co-Optimization
