Enabling the Next Era of Heterogeneous Integration with Panel-Level Packaging Innovation and Commercialization

10:50 am - 11:15 am

Advanced packaging has become the new scaling engine for the semiconductor industry. The rapid adoption of AI is accelerating demand for larger package formats, higher interconnect density, and more complex heterogeneous integration schemes that combine logic, memory, and co-package optics within a single system. Meeting these requirements will require manufacturing platforms that can scale beyond the limitations of traditional wafer-based processing.

Panel Level Packaging represents a significant architectural shift by extending semiconductor packaging processes onto larger panel formats, creating a pathway to higher throughput, improved cost efficiency, lower environmental impact, and support for future package dimensions that may be impractical on wafer-scale carriers. At the same time, realizing semiconductor-class density at panel scale requires breakthroughs in lithography, materials engineering, substrate technology, inspection, process integration, and manufacturing control.

Applied Materials is advancing this transition through a co-innovation and commercialization strategy built on deep collaboration across the semiconductor ecosystem. By combining new materials, differentiated process technologies, and a broad panel packaging equipment portfolio, the industry can accelerate development of fine-line RDL, advanced substrates, glass-core architectures, and next-generation interconnect technologies needed to support future AI and HPC platforms. This talk explores the technology roadmap, critical innovation challenges, and commercialization pathways shaping the future of panel-based heterogeneous integration.

Key Technologies Covered

Panel-Level Packaging (PLP)
Large Panel Form-Factor 510x515mm
Advanced Substrate Build-Up Scaling
Fine-Line RDL Panel Integration
Through-Glass Via (TGV) Enablement
Process Co-Optimization and Co-Innovation

Featured Speakers

Mr. Michael Rosshirt

Account Technologist Director, Applied Materials

Michael Rosshirt is Director of Panel Technology Enablement for Advanced Packaging at Applied Materials, where he leads customer co-innovation and the commercialization of next-generation panel-level packaging (PLP) solutions.

With more than 15 years of experience in advanced packaging, Michael has worked across substrates, assembly, test, and product technology development. Prior to joining Applied Materials, he held multiple roles at Intel focused on advanced packaging platform integration, yield improvement, design optimization, and integrated thermal-mechanical analytics. His experience spans 2.5D, 3D and Hybrid-Bonding packaging technologies along with substrate design and manufacturing across all phases of the product life-cycle from pathfinding through HVM.

Michael is passionate about leveraging data analytics and data-driven storytelling to accelerate technology adoption and business impact. He holds a Master of Science in Mechanical Engineering from Santa Clara University.