Enabling High-Volume and Cost-Efficient AI Packaging Through Full Field Projection Lithography
Artificial Intelligence is reshaping the semiconductor industry at an unprecedented pace, driving rapidly increasing performance requirements, technology complexity, and capacity demand. As a result, next-generation lithography solutions, like many other equipment types, must combine three critical requirements more than ever: technical performance, scalable high-volume manufacturing capability, and particularly high economic efficiency.
At the same time, with traditional 2D Front-End scaling becoming more challenging, the industry is shifting toward heterogeneous integration, combining multiple high-performance and specialized chiplets into increasingly large and complex packages.
SUSS supports these industry requirements with our battle-proven full field projection solution. The platform maintains high throughput independent of package size, which is a key for AI applications. It eliminates stitching to ensure highest-yield manufacturing while offering extensive versatility for Advanced Packaging lithography processes. It allows for high resolution of 1µm in thin resist to high aspect ratios in >300µm thick film via creation, both on wafers and panels.
Key Technologies Covered
- AI-driven performance and capacity demands in semiconductor manufacturing
- Next-generation lithography system requirements (performance, scalability, cost efficiency)
- Transition from 2D front-end scaling to heterogeneous integration
- Advanced packaging technologies for chiplet-based architectures
- Full-field projection lithography as an alternative to stitching-based methods
- Stitching-free lithography for improved yield and manufacturing reliability
- High-throughput processing independent of package or substrate size
- Versatile lithography processes for both wafers and panels
- High-resolution patterning
- High aspect ratio structuring for advanced packaging applications
