Strategic Materials Conference Taiwan

aterials are the foundation of every semiconductor breakthrough. Every leap in process performance and packaging density is ultimately enabled by a material innovation — a new film, a better conductor, a more precise bonding interface. As the industry pushes toward GAA and advanced 3D logic architectures and advanced packaging scales from heterogeneous integration to glass substrates and TGV, the materials challenges are intensifying across atomic-scale deposition, precursor chemistry, interconnect scaling, and supply chain resilience. This year Strategic Materials Conference (SMC) Taiwan will bring together voices from across the ecosystem — material suppliers, equipment makers, and end customers — to examine how front-end process materials, advanced packaging materials, AI-driven materials development, and supply chain readiness are shaping the future of semiconductor manufacturing. An essential forum for process engineers, packaging specialists, materials researchers, and supply chain strategists working at the forefront of semiconductor innovation.