SEMI, the global industry association connecting the electronics design and manufacturing supply chain, and Silicon Catalyst, the world's only accelerator focused exclusively on semiconductor innovation, today announced a global strategic partnership designed to accelerate innovation and strengthen connections between semiconductor hardware startups, investors, manufacturers, and technology leaders worldwide. The partnership was formalized through the signing of a Memorandum of Understanding (MOU) at SEMICON Taiwan 2026.
2026.09.02 SEMICON Taiwan 2026 Opens Global Tech Leaders Chart the Future of AI Semiconductors
SEMI today opened SEMICON Taiwan 2026 at TaiNEX, bringing together leaders from across industry, government and academia. Ajit Manocha, President and CEO of SEMI; Chih-I Wu, President of the Taiwan Semiconductor Industry Association (TSIA); and Jung-Tai Cho, Premier of Executive Yuan, R.O.C., delivered opening remarks, while Raymond Greene, Director of the American Institute in Taiwan (AIT), received the Semiconductor Partnership Leadership Award for his contributions to advancing U.S.-Taiwan semiconductor collaboration.
2026.09.01 SEMICON Taiwan 2026 Dream Fab Opens: Inside the World of Chipmaking
Semiconductor manufacturing brings together specialized expertise across design, fabrication, packaging, testing, equipment, and materials. As AI drives greater scale and complexity, tighter integration across the supply chain is becoming essential. At the heart of it all is the fab, where these technologies and processes come together to make chips. Yet the fab itself remain largely unseen by the public.
2026.08.31 SEMICON Taiwan 2026 Charts Semiconductor Innovation from AI to Quantum
SEMICON Taiwan 2026, one of the world’s leading semiconductor industry events, arrives as AI, advanced manufacturing, heterogeneous integration, and quantum technologies reshape the industry. At today’s pre-show press conference, SEMI brought together Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI; Dr. Tien Wu, Chair of the SEMI International Board of Directors and Chief Executive Officer of ASE; Chii-Dong Chen, Distinguished Research Fellow and Executive Officer of the Thematic Center for Quantum Computing, Research Center for Critical Issues, Academia Sinica; and Clark Tseng, Senior Director of Market Intelligence, SEMI. Together, they highlighted how AI is accelerating innovation across advanced computing, manufacturing, heterogeneous integration, and quantum technologies, and why Taiwan’s highly integrated ecosystem is at the center of this transformation.
2026.08.19 SEMICON Taiwan 2026 Expands Global Platform for Semiconductor Startups
From advanced semiconductor devices and manufacturing technologies to AI-driven systems, silicon photonics, power electronics, and sustainable manufacturing, semiconductor innovation is accelerating across industries. For startups, however, breakthrough technology is only the beginning: the ability to quickly connect with industry, capital, customers, manufacturing partners, investors and global markets is critical to turning innovation into commercialization.
2026.08.14 SEMICON Taiwan 2026 Debuts First Full-Day CEO Forum and Ecosystem Executive Summit
The semiconductor industry’s AI-era transformation is shifting from isolated breakthroughs to global ecosystem collaboration. Reflecting this shift, the SEMICON Taiwan 2026 CEO Summit and Ecosystem Executive Summit will expand to a full-day program spanning cloud and accelerated computing, memory, interconnects, power management and system co-design, as well as advanced packaging, process equipment and critical materials, covering the technologies needed to take AI from innovation to deployment at scale. The closing fireside chat will, for the first time, unite leaders from Taiwan’s five key electronics supply chain sectors: IC design, wafer fabrication, packaging, substrates, and electronics manufacturing, to examine its evolving partnership with the global semiconductor industry, from past collaboration and today’s AI demand to future strategies, helping define the next model of global collaboration. The Summit will take place on September 2 at TaiNEX Hall 2.
2026.08.12 Testing and Metrology Emerge as a New Front in the AI Race
Scaling AI chip supply takes more than fab capacity; advanced packaging, testing and metrology must keep pace. As process nodes shrink and chip architectures grow more complex, testing validates functionality and performance, while metrology ensures tighter process control. With AI chips rising in value and complexity, both are moving to the forefront of advanced manufacturing, directly impacting yield, performance and time to volume. To spotlight these shifts, SEMI today convened its first “Semiconductor Testing and Metrology in the AI Era: Industry Insights and Advocacy Press Conference”, hosted by Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI, with insights from I-Shih Tseng, CEO and President of Chroma ATE Inc. and Chair of the SEMI Inspection & Metrology Committee, and Gauss Chang, President of KYEC, along with more than 20 industry representatives.
Frontier AI training compute is growing four-to fivefold annually, pushing power and data movement to the center of the performance race. As competition shifts from individual chips to system-level integration, SEMICON Taiwan 2026 will feature three dedicated technology platforms this September: the AI Technology Zone focusing on ASICs and AI chip design, the Memory Executive Summit exploring high-bandwidth memory (HBM), and the Silicon Photonics Pavilion showcasing high-speed interconnect technologies and applications, connecting the critical building blocks of next-generation AI computing.
SEMICON Taiwan 2026 will feature a record 18 countries across its Global Pavilion. Today, SEMI hosted the first-ever SEMICON Taiwan 2026 Global Pavilion Press Conference, led by Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. The event brought together Cynthia Kiang, Deputy Minister of Economic Affairs, and 17 representatives, including the United States (U.S.), Japan, the European Union (EU), and the United Kingdom (UK). Their first joint appearance ahead of the exhibition underscored the increasingly global and collaborative nature of the semiconductor industry.
2026.07.08 SEMICON Taiwan 2026 Highlights AI-Driven Manufacturing Transformation
AI is reshaping semiconductor manufacturing investment and production worldwide. SEMI projects that global 300mm fab equipment spending will exceed US$150 billion for the first time in 2027, driven by surging demand for AI chips, continued investment in advanced capacity, and the industry’s ongoing focus on supply chain resilience.
2026.06.15 SEMICON Taiwan 2026 to Serve as Global Stage Where the Semiconductor Industry Defines What’s Next
SEMICON Taiwan 2026, one of the global semiconductor industry’s flagship annual events, will be held September 2-4 at the Nangang Exhibition Center in Taipei, with forums beginning on August 31 to align with International Semiconductor Week. The exhibition is expected to feature more than 1,300 exhibitors and 4,300 booths—both record highs—and attract over 100,000 professionals from 65 countries. Registration is open.