Keynote: Scaling AI Infrastructure: The Role of Heterogeneous Integration in Co-Packaged Optics

9:25 am - 9:50 am

As inference workloads drive demand for larger compute domains, co-packaged optics-based scale-up

networks have become essential for the next generation of AI infrastructure. This talk presents an

approach to scaling AI infrastructure, starting from system- and rack-level total-cost-of-ownership

requirements and drilling down to the optical engine at the heart of a co-packaged optics scale-up

solution. Key integration choices are analyzed to determine how an optical engine can achieve the

performance, reliability and manufacturability scaling required by the application. The analysis identifies

the advances in heterogeneous integration as foundational to manufacturable, multi-generational

optical engines for AI.

 

Key Technologies Covered

  • Co-packaged optics
  • Heterogeneous electronic-photonic integration
  • Die-on-wafer integration
  • Optically-connected racks for AI scale up

Featured Speakers

Dr. Vladimir Stojanovic

Dr. Vladimir Stojanovic

CTO, Ayar Labs

Vladimir is the Chief Technology Officer of Ayar Labs. Prior to founding Ayar Labs, he led the team that designed the world’s first processor to communicate using light. Vladimir was recently a professor of EECS at UC Berkeley, and was one of the key developers of the Rambus high-speed link technology. He holds a PhD from Stanford University.