Mr. Michael Rosshirt
Account Technologist Director, Applied Materials
Michael Rosshirt is Director of Panel Technology Enablement for Advanced Packaging at Applied Materials, where he leads customer co-innovation and the commercialization of next-generation panel-level packaging (PLP) solutions.
With more than 15 years of experience in advanced packaging, Michael has worked across substrates, assembly, test, and product technology development. Prior to joining Applied Materials, he held multiple roles at Intel focused on advanced packaging platform integration, yield improvement, design optimization, and integrated thermal-mechanical analytics. His experience spans 2.5D, 3D and Hybrid-Bonding packaging technologies along with substrate design and manufacturing across all phases of the product life-cycle from pathfinding through HVM.
Michael is passionate about leveraging data analytics and data-driven storytelling to accelerate technology adoption and business impact. He holds a Master of Science in Mechanical Engineering from Santa Clara University.