功率暨化合物半導體論壇

The 2026 Power and Compound Semiconductor Forum, themed “Empowering the AI Infrastructure Era,” will explore how power and compound semiconductor technologies are driving next-generation AI infrastructure, high-performance computing, and advanced connectivity applications. The forum will focus on key industry topics including optical link, power efficiency, thermal management, reliability, and supply chain resilience in the AI era.

The forum will cover several major areas, including AI Data Center Infrastructure, focusing on Grid-to-Chip power, 48V/HVDC ecosystem, vertical power delivery, and thermal management; WBG/UWBG technologies, including SiC/GaN scale-up, integrated GaN Power IC, ultra-wide bandgap materials, and reliability testing; as well as Photonics Interconnect and Connectivity & Mobility applications such as III-V materials, high-power InP lasers, 6G, LiDAR, autonomous systems, and EV fast charging.

Through industry presentations and executive discussions, the forum will bring together wafer manufacturers, IDMs, material suppliers, equipment companies, and technology leaders across the power and compound semiconductor ecosystem to discuss future developments in AI infrastructure and high-power applications.