Coherent CPO/NPO Technology Briefing

上午 11:15 - 上午 11:40

This presentation provides an overview of Coherent’s leadership in diode laser technology and its advancements in Co-packaged Optics (CPO) and related photonics solutions. It highlights Coherent’s extensive experience, robust product portfolio, and innovations in VCSELs, InP lasers, and silicon photonics. The briefing emphasizes how pluggable transceivers and CPO architectures expand market opportunities by reducing power consumption, increasing bandwidth density, and enabling scalable, reliable optical interconnects. Additionally, it covers Coherent’s differentiated optical circuit switch (OCS) and software stack, showcasing proven reliability and integration across datacom and subsea applications.

 

Key Technologies Covered

  • GaAs VCSELs – 200G/lane VCSEL-based transceivers, demonstrated 1.6T at OFC 2025.
  • InP EMLs/DMLs – 400G differential EML transceivers demonstrated at OFC 2025.
  • InP CW Lasers & Silicon Photonics – 1.6T DR8 demonstrated at ECOC 2024, higher-power versions in development.
  • Pluggable Transceivers – Flexible, standardized ecosystem with scalable bandwidth density.
  • Co-packaged Optics (CPO) – Miniaturized transceivers near switch/xPU chips, reducing power, latency, and cost.
  • VCSEL-based NPO/CPO – Low-cost, low-power arrays, widely used in 3D sensing and datacom.
  • Silicon Photonics-based CPO – Single-mode, long-distance support with remote InP CW lasers for reliability.
  • Micro-Lens Arrays & Fiber Attach Units – Enabling high-density optical coupling in CPO systems.
  • Optical Circuit Switch (OCS) – Liquid crystal technology with no moving parts, proven reliability in subsea applications.
  • Integrated Software Stack – Onboard control electronics and network management, shipping into OCS for over 10 years.

Featured Speakers

Dr. Yi-Yung Chen

Dr. Yi-Yung Chen

CPO/NPO Technology Expert, Coherent

Dr. Chen is a technical communicator and cross-disciplinary integration specialist focused on advanced semiconductor packaging and photonics module development. His work spans CPO (Co-Packaged Optics), VCSEL/EEL optical engines, thermal management, heterogeneous integration, and system-level packaging architectures. With experience across design, module integration, NPI, and mass production readiness, he bridges optical, mechanical, thermal, and materials engineering teams to accelerate product development in high-complexity environments.

He specializes in translating intricate engineering concepts into executable specifications, design guidelines, and cross-team communication frameworks. His contributions include establishing technical documentation systems, integration workflows, and decision-making structures that support high-speed interconnects, optical module reliability, and next-generation packaging requirements driven by AI and high-performance computing. In recent years, his focus has centered on photonics-enabled packaging, thermal path optimization, reliability modeling, and the collaborative processes required for emerging CPO and advanced optical module architectures. He is committed to strengthening industry capabilities in knowledge transfer, cross-functional alignment, and engineering education—critical foundations for the rapidly evolving semiconductor and photonics ecosystem.