移至主內容

Advancing the Frontiers of SiC Power Devices across the Voltage Spectrum

上午 11:15 - 上午 11:40

Silicon carbide (SiC) power devices are driving the next generation of high-efficiency and high-voltage power electronics. Here, we will present A*STAR’s latest progress on the development of an 8-inch SiC power device platform, covering a broad range of device technologies from low-voltage switching to high-voltage power conversion applications. The platform includes the fabrication and characterization of 8-inch SiC planar MOSFETs, trench MOSFETs, and FinFET structures, demonstrating enhanced device performance, scalability, and manufacturability on large-area wafers. In addition, a 6.5 kV SiC PiN diode development will be presented to address high-voltage and high-power system requirements. Key achievements in device design, process integration, and electrical performance will be covered, highlighting the potential of 8-inch SiC technology for future energy-efficient power systems and industrial applications.

 

Key Technologies Covered

  • Fabrication and characterization of 8-inch SiC planar MOSFETs, trench MOSFETs, and FinFET structures
  • 6.5 kV SiC PiN diode development

Featured Speakers

Prof. Xiao Gong

Dr. Gong Xiao

Head of Department, Institute of Microelectronics, A*STAR, Singapore

Dr. Gong Xiao obtained his Ph. D Degree from NUS and was a Visiting Scientist at MIT in the year of 2014. His research interest includes advanced transistors and emerging memories for in-memory computing, monolithic 3D integration, opto-electronic integrated circuits and their applications in quantum technology, as well as ultra-high frequency and ultra-wide bandgap device technology. He has won many awards, including the Bronze Medal at the 6th TSMC Outstanding Student Researcher Award, the Best Student Paper Award at VLSI Symposium (2017 and 2021), the Best Demo Paper Award at VLSI Symposium (2022 and 2023), the Best Student Paper Award at ICICDT (2019, 2021, and 2023), Emerging Leaders in Journal of Physics D 2021, and NUS Engineering Teaching Excellence Award (2018 and 2023). He has more than 330 publications in international journals and conferences, including more than 80 papers in IEDM and VLSI Symposium. He is the Technical Program Chair in ICICDT (2019, 2022, 2023, 2024) and Sub-committee Chair in ICICDT (2021) and EDTM (2022, 2023, 2025), and in the technical committees of IEDM (2021, 2022), VLSI-TSA (2022, 2023, 2024, 2025), ECS (2014, 2016, 2018, 2020, 2022, and 2024), ICMAT (2017), EDTM (2017 to 2021, 2023, 2025), IWJT (2021, 2023), etc. He is the Editor of IEEE Electron Device Letters.