矽光子國際論壇
From Die-to-Die to Rack-to-Rack: Engineering the Photonic Fabric for Hyperscale AI Clusters
As AI and high-performance computing workloads continue to surge, interconnect bandwidth and power efficiency have become the defining constraints of next-generation data center architecture. Silicon photonics is rapidly emerging as the critical enabler to overcome these limitations.
This summit brings together global industry leaders across the ecosystem—from system architecture, interconnect technologies, to advanced manufacturing—to explore how silicon photonics can scale from innovation to high-volume deployment.
With a focus on architecture evolution, integration innovation, and manufacturing readiness, the program aims to provide a comprehensive view of how the industry is converging to support AI infrastructure at scale.
SEMI 會員
非會員
SEMI 會員
非會員
SEMI 會員
非會員
SEMI 會員
非會員