3DIC全球高峰論壇

As AI, high-performance computing (HPC), and data-centric applications continue to drive unprecedented demand for advanced semiconductors, advanced packaging technologies such as 2.5D, 3DIC, and heterogeneous integration have become critical enablers for system-level performance, power efficiency, and scalability. Beyond technology innovation, the industry is now facing a new phase, scaling advanced packaging into high-volume manufacturing while meeting increasingly stringent system-level requirements, including thermal management, and integration complexity.

This forum brings together leaders from across the semiconductor ecosystem, including foundry, OSAT, system integrators, equipment, materials, and software providers to explore how to achieve manufacturing readiness and system-level optimization in the AI era.

Discussions will cover key topics such as capacity scaling, process integration, yield optimization and thermal challenges, and supply chain alignment, as well as the growing role of design-technology co-optimization (DTCO), simulation, and AI-driven automation in improving manufacturing efficiency and accelerating time-to-market. Through keynote presentations and panel discussions, the session aims to foster cross-ecosystem collaboration, bridge design and manufacturing, and accelerate the deployment of scalable, manufacturable, and system-optimized advanced packaging solutions.