張欣晴博士
副總經理, 日月光
Dr. Harrison Chang is responsible for co-design System-in-Package with customers and meet application specific requirement. He has been working on the heterogeneous integration for applications including
- powerSiP® for HPC packages
- Automotive power electronics
- Smart phone and wearable SiP
- High speed electronic, AI in IoT
- WWAN/WLAN modem SiP
- 5G and beyond system
- mmWave antenna-in-package
- Using AI/ML on RF design
- Bio-sensing on flexible 3D SiP
Power development is one of the most critical issues in the era of AI . Whether it is power generation, energy storage, computational efficiency, or thermal management, all of these aspects require innovative solutions at the system and packaging levels. I look forward to working with Members of the industry in various roles to discuss and develop short-medium and long-term strategies to tackle these key technology challenges.