Solving AI DC Power Challenges with Advanced Packaging

下午 1:35 - 下午 2:00

Advanced packaging solves AI data center power challenges by enabling vertical power delivery to computing chiplets, memory, and switches. These innovations reduce resistive losses, shorten electrical paths, and improve thermal dissipation. Miniaturization is possible when advanced packaging that integrates passives, as well as WBG (e.g. GaN) devices for high efficiency of voltage conversion.

Vertical power delivery resolves AI hardware power bottlenecks by routing current vertically from voltage regulators positioned directly underneath the processor die, rather than laterally across the motherboard. This vertical architecture shortens electrical paths from centimeters to millimeters, drastically reducing resistance and power losses (I²R) for chips demanding over 1,000 amperes. By eliminating lateral power routing, VPD also frees up valuable perimeter space on the silicon for high-bandwidth memory (HBM), while simultaneously stabilizing voltage delivery and minimizing noise at the transistor layer.

Future generation of power solution, called Integrated Voltage Regulation (IVR), may integrate the power devices inside of the CoWoS structure. It makes possible for even higher efficiency of power conversion and conversion.

Key Technologies Covered

Advanced Packaging
Power Integrity (PI)
Vertical Power Delivery (VPD)
Voltage Regulator Module (VRM)
Resistive Power Loss (I²R)
On-Package Capacitors

Featured Speakers

張欣晴博士

副總經理, 日月光

Dr. Harrison Chang is responsible for co-design System-in-Package with customers and meet application specific requirement. He has been working on the heterogeneous integration for applications including

powerSiP® for HPC packages
Automotive power electronics
Smart phone and wearable SiP
High speed electronic, AI in IoT
WWAN/WLAN modem SiP
5G and beyond system
mmWave antenna-in-package
Using AI/ML on RF design
Bio-sensing on flexible 3D SiP

Power development is one of the most critical issues in the era of AI . Whether it is power generation, energy storage, computational efficiency, or thermal management, all of these aspects require innovative solutions at the system and packaging levels. I look forward to working with Members of the industry in various roles to discuss and develop short-medium and long-term strategies to tackle these key technology challenges.