記憶體高峰論壇
The Co-Design Era: Memory as the Strategic Heart of AI Intelligence
The memory industry is entering a decisive new phase. What was once viewed as a standardized component is now
becoming a strategic asset at the heart of the AI era. As AI adoption accelerates—particularly at scale for inference—
memory is no longer defined by capacity alone, but by how early and how deeply it is integrated into system design.
This shift is being driven by both market forces and structural realities. Global semiconductor revenues are expected to
approach US$975 billion by 2026, with memory emerging as one of the fastest-growing segments, projected to exceed
US$440 billion. At the same time, supply constraints and rising system complexity are pushing the industry beyond
traditional supplier–customer relationships toward closer, long-term co-design partnerships across the ecosystem.
Rather than solving isolated performance bottlenecks, the next phase of innovation is redefining where value is created.
Memory is increasingly shaping system architectures, influencing platform strategies, and determining differentiation across
data center, enterprise, and edge deployments.
SEMICON Taiwan 2026 Memory Executive Summit is designed for leaders navigating this transition. The summit will bring
together executives across the memory, logic, and manufacturing landscape to align perspectives, anticipate strategic
inflection points, and explore how memory can become a lever for growth and competitive advantage in an increasingly
intelligent and autonomous world.
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SEMI 會員
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SEMI 會員
非會員
SEMI 會員
非會員