2026 異質整合國際高峰論壇 – 第二天

As the demand for AI, HPC, and high-speed computing continues to accelerate, the semiconductor industry is facing growing challenges in performance, power efficiency, bandwidth, and thermal management. Heterogeneous integration has become a key enabler for next-generation computing architectures, while the convergence of multiple technologies is reshaping the semiconductor ecosystem and accelerating innovation across the supply chain.
This forum will focus on the breakthrough technologies and converging innovations driving the next generation of heterogeneous integration. The program will explore key advancements across chiplet integration, Co-Packaged Optics (CPO), thermal management, advanced packaging modules and systems, as well as emerging substrate, connectivity, and test solutions enabling future AI and HPC applications.
This session will also highlight discussions on cost-effective heterogeneous integration approaches, heat dissipation technologies, HBM, GaN packaging, and other enabling technologies shaping the future semiconductor ecosystem.