Keynote: Package and Integration Technologies for High Current Density Power Module in AI/Data Center
下午 1:30 - 下午 2:00
The DC power consumption of GPU/ASIC/switching ICs in AI/Data Center increases dramatically, reaching 2-3KW per chip. In addition, to reduce the power loss from the PDN, a vertical power delivery is requested, which makes the last DC power conversion module, needed not only a higher power density delivery but also a lower physical profile. This presentation highlights the essential advanced package technologies and how to integrate them together, in order to provide the solution for this challenging demands.
Key Technologies Covered
- Embedded substrates
- Thin film inductors and capacitors
- Vertical power delivery (VPD)
- Integrated vertical regulator (IVR)
