沈里正​博士

Dr. Li-Cheng Shen received his B.S., M.S., and Ph.D. in Electrical and Control Engineering from National Yang Ming Chiao Tung University (NYCU), Taiwan, in 1992, 1994, and 1998, respectively. Majors in school included control system design, expert system, intelligent automation, system fault diagnosis, and multivariable analysis.

He is currently the AVP of Miniaturization Competence Center (MCC)/USI, focusing on researching and developing cutting-edge technologies of module & system miniaturization. Application fields cover smartphone, WWAN, wearable, automotive, high performance computing, power module, SiPh, and consu-medical.

With more than 20 years of experience in the semiconductor industry, Dr. Shen owned more than 30 patents in the fields of Fault Diagnosis System, 3D Package, Wafer Level Package, Opto-electronic Package, Electro-optical Circuit Board, Embedded Component Substrates, RF Module Testing and RF SiP/System Assembly. He is also the technical sub-committee member of Electrical Design & Analysis (ED&A), ECTC since 2014.