Intelligent X-ray Inspection for the Next Generation of Heterogeneous Integration
The rapid evolution of AI, high-performance computing (HPC), and next-generation semiconductor devices is accelerating innovation in heterogeneous integration and advanced packaging technologies. Emerging approaches such as glass panel-based packaging illustrate the strong momentum toward increasingly complex semiconductor architectures, higher interconnect densities, and larger package formats. As a result, manufacturers face growing challenges in inspection, metrology, defect analysis, and process optimization.
This presentation demonstrates how advanced 2D and 3D X-ray inspection combined with intelligent AI-driven image analysis enables scalable, non-destructive inspection workflows for heterogeneous integration applications. It will present the results of automated TSV classification as an example of AI-assisted inspection, including a quantitative repeatability analysis, and discuss how intelligent image analysis improves defect detection, classification, and process understanding. Looking ahead, the presentation will explore glass panel technologies as an emerging packaging platform, highlighting TGV inspection as a representative use case.
Key Technologies Covered
- AI-driven image analysis integrated with X-ray inspection.
- Advanced 2D and 3D X-ray inspection technologies.
- Application in heterogeneous integration and advanced semiconductor packaging and glass panel-based packaging.
- Addressing challenges in inspection, metrology, defect analysis, and process optimization.
- Enabling scalable, non-destructive inspection workflows.
- Accelerating defect classification and root-cause analysis through AI.
- Extracting actionable insights from complex imaging datasets.
- Supporting data-driven process understanding in semiconductor manufacturing.
- Targeting next-generation semiconductor devices and high-performance computing (HPC) applications.
