Transform Tomorrow
Under the theme “Transform Tomorrow,” SEMICON Taiwan 2026 brings together the wafer manufacturing, equipment and materials, IC design, system applications, and startup ecosystems, serving as a key nexus connecting the global technology industry.
The exhibition will spotlight key fields including AI, robotics, silicon photonics, advanced process technologies, advanced packaging, quantum technologies, and smart manufacturing. It will bring together engineering and technical talent, business decision-makers, investors, startup teams, and media analysts to explore the next generation of technological development and build a collaborative platform for the semiconductor industry and cross-disciplinary innovation.
Click the featured topics below to explore the corresponding highlighted pavilions and forums!
Pavilions
Forums
- FOPLP Innovation Forum – HIGS Series Event
- Heterogeneous Integration Global Summit 2026 – Day 1 (AI & HPC & Chiplet)
- Heterogeneous Integration Global Summit 2026 – Day 2
- Heterogeneous Integration Global Summit 2026 – Day 3 (Supply Chain)
- 3DIC Global Summit
- Strategic Materials Conference Taiwan
- Advanced Testing Forum
Pavilions
Pavilions
Forums
- TBC
Pavilions