IC Forum-Advanced Chip Technology and Manufacturing
Monday, August 31 | 8:30 am - 4:55 pm
Theme
Synergetic Advanced Nodes: Empowering AI for Chips & Crafting Next-Gen AI Silicon
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Overview
Advanced chip technology and manufacturing sits at the center of the AI semiconductor ecosystem — as each new node generation arrives, it brings not just incremental gains but architectural possibilities that redefine the boundaries of AI compute. Yet the relationship runs both ways: AI is increasingly becoming a tool within chipmaking itself, changing how engineers design, optimize, and validate the very chips that power it.
The IC Forum maps this evolving landscape — from FinFET to GAA/Nanosheet and beyond, covering cutting-edge process technologies including EUV, ALD, and the emerging BSPDN architecture — alongside the materials and equipment ecosystem enabling each node transition, and how AI-driven approaches from EDA automation to process optimization are reshaping chip manufacturing from the inside out.
For anyone tracking where semiconductor technology is headed, the IC Forum offers a grounded, multi-angle view of the forces shaping the next generation of advanced nodes and AI silicon.
Period
SEMI Member
Non-member
Super Early-Bird
5/20 - 6/17
Valid Student ID Required
NT$ 882
1 DayNT$ 13,755
2 DaysNT$ 26,040
3 DaysNT$ 36,960
4 DaysNT$ 46,515
5 DaysNT$ 54,915
Group Registration (available until August 19): Register 3 or more participants, or register for more than 3 forums hosted by SEMI Taiwan, to receive a 15% discount on each purchase.
* The organizer reserves the right to adjust or change the agenda. The final agenda is subject to the on-site arrangement.
Featured Speakers
Chief Technology Officer, Merck
Vice President R&D Advanced Patterning Development, imec
Corporate Vice President, Lam Research
Senior Director, Applied Materials (Singapore)
General Manager Technology Strategy, Tokyo Electron
R&D Senior Vice President & GM, Tokyo Electron America
Head of Roadmap SMT / Senior Principal, ZEISS SMT
R&D Global Technical Leader, Qnity Electronics, Inc.
Technology strategy and management, Brewer Science, Inc.
Head of Products, Siemens
Agenda
Keynote: Expand AI with Leadership Silicon & System Integration
Advancing Materials Innovation Velocity with AI
Dr. Surésh Rajaraman
Merck
Frontiers of Plasma etch technologies to enable 3D devices for AI applications
Dr. Gowri Kamarthy
Lam Research
AI at Scale: Breaking the Energy Wall with HI
Dr. Ashok Kumar Muthukumaran
Applied Materials (Singapore)
Technical Innovations at a Semiconductor Equipment Supplier in the AI Era
Dr. Peter Loewenhardt
Tokyo Electron
Dr. Akihisa Sekiguchi
Tokyo Electron America
Optics for Advanced Chip Manufacturing
Dr. Heiko Feldmann
ZEISS SMT
ALD innovations for advanced semiconductor nodes
Advanced CMP Pad Engineering for Enabling Next-Generation AI Chip Planarization
Dr. Ivan Li
Qnity Electronics, Inc.
Navigating the Patterning Landscape in the Era of AI-Driven Semiconductor Manufacturing
Dr. Douglas Guerrero
Brewer Science, Inc.
AI-Native EDA: Designing the Chips That Power the Future
Mr. Sathish Balasubramanian
Siemens