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IC Forum-Advanced Chip Technology and Manufacturing

Monday, August 31 | 8:30 am - 4:55 pm
Theme

Synergetic Advanced Nodes: Empowering AI for Chips & Crafting Next-Gen AI Silicon

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Overview

Advanced chip technology and manufacturing sits at the center of the AI semiconductor ecosystem — as each new node generation arrives, it brings not just incremental gains but architectural possibilities that redefine the boundaries of AI compute. Yet the relationship runs both ways: AI is increasingly becoming a tool within chipmaking itself, changing how engineers design, optimize, and validate the very chips that power it.
The IC Forum maps this evolving landscape — from FinFET to GAA/Nanosheet and beyond, covering cutting-edge process technologies including EUV, ALD, and the emerging BSPDN architecture — alongside the materials and equipment ecosystem enabling each node transition, and how AI-driven approaches from EDA automation to process optimization are reshaping chip manufacturing from the inside out.
For anyone tracking where semiconductor technology is headed, the IC Forum offers a grounded, multi-angle view of the forces shaping the next generation of advanced nodes and AI silicon.

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Registration Fees (Tax Included)

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Period
SEMI Member
Non-member
Super Early-Bird
5/20 - 6/17

SEMI Member

NT$ 3,308

Non-member

NT$ 4,337
Early-Bird
6/18 - 8/5

SEMI Member

NT$ 3,780

Non-member

NT$ 4,956
Regular
8/6 - 8/30

SEMI Member

NT$ 4,725

Non-member

NT$ 6,195
On-Site
8/31 - 9/4

SEMI Member

NT$ 6,143

Non-member

NT$ 8,054
Student
EMBA Excluded
Valid Student ID Required
NT$ 882
Day Pass
(Tax Included)
1 DayNT$ 13,755
2 DaysNT$ 26,040
3 DaysNT$ 36,960
4 DaysNT$ 46,515
5 DaysNT$ 54,915
Group Registration (available until August 19): Register 3 or more participants, or register for more than 3 forums hosted by SEMI Taiwan, to receive a 15% discount on each purchase.
* The organizer reserves the right to adjust or change the agenda. The final agenda is subject to the on-site arrangement.

Featured Speakers

Ms. April Li

Ms. April Li

Director, TSMC

Keynote Speaker

Dr. Surésh Rajaraman

Dr. Surésh Rajaraman

Chief Technology Officer, Merck

Speaker

Dr. Philippe Leray

Dr. Philippe Leray

Vice President R&D Advanced Patterning Development, imec

Speaker

Dr. Gowri Kamarthy

Dr. Gowri Kamarthy

Corporate Vice President, Lam Research

Speaker

Dr. Ashok Kumar Muthukumaran

Dr. Ashok Kumar Muthukumaran

Senior Director, Applied Materials (Singapore)

Speaker

Dr. Peter Loewenhardt

Dr. Peter Loewenhardt

General Manager Technology Strategy, Tokyo Electron

Speaker

Dr. Akihisa Sekiguchi

Dr. Akihisa Sekiguchi

R&D Senior Vice President & GM, Tokyo Electron America

Speaker

Dr. Heiko Feldmann

Dr. Heiko Feldmann

Head of Roadmap SMT / Senior Principal, ZEISS SMT

Speaker

Mr. Abhudaya Mishra

Dr. Abhudaya Mishra

Corporate Director, ASM

Speaker

Dr. Ivan Li

Dr. Ivan Li

R&D Global Technical Leader, Qnity Electronics, Inc.

Speaker

Dr. Douglas Guerrero

Dr. Douglas Guerrero

Technology strategy and management, Brewer Science, Inc.

Speaker

Mr. Sathish Balasubramanian

Mr. Sathish Balasubramanian

Head of Products, Siemens

Speaker

Agenda

Registration

8:30 am - 9:00 am

Keynote: Expand AI with Leadership Silicon & System Integration

Ms. April Li

TSMC
9:10 am - 9:40 am

Advancing Materials Innovation Velocity with AI

Dr. Surésh Rajaraman

Merck
9:40 am - 10:05 am

TBC

Dr. Philippe Leray

imec
10:05 am - 10:30 am

Break Time

10:30 am - 10:45 am

Frontiers of Plasma etch technologies to enable 3D devices for AI applications

Dr. Gowri Kamarthy

Lam Research
10:45 am - 11:10 am

AI at Scale: Breaking the Energy Wall with HI

Dr. Ashok Kumar Muthukumaran

Applied Materials (Singapore)
11:10 am - 11:35 am

Technical Innovations at a Semiconductor Equipment Supplier in the AI Era

Dr. Peter Loewenhardt

Tokyo Electron

Dr. Akihisa Sekiguchi

Tokyo Electron America
11:35 am - 12:00 pm

Lunch Break​

12:00 pm - 1:30 pm

Optics for Advanced Chip Manufacturing

Dr. Heiko Feldmann

ZEISS SMT
2:00 pm - 2:25 pm

ALD innovations for advanced semiconductor nodes

Dr. Abhudaya Mishra

ASM
2:25 pm - 2:50 pm

Advanced CMP Pad Engineering for Enabling Next-Generation AI Chip Planarization

Dr. Ivan Li

Qnity Electronics, Inc.
2:50 pm - 3:15 pm

Break Time

3:15 pm - 3:30 pm

Navigating the Patterning Landscape in the Era of AI-Driven Semiconductor Manufacturing

Dr. Douglas Guerrero

Brewer Science, Inc.
3:30 pm - 3:55 pm

AI-Native EDA: Designing the Chips That Power the Future

Mr. Sathish Balasubramanian

Siemens
3:55 pm - 4:20 pm

Adjournment

4:55 pm