FOPLP Innovation Forum - HIGS Series Event
Monday, August 31 | 1:00 pm - 5:00 pm
System Scaling in FOPLP: Integrating Materials, Processes, and Equipment
Venue: Grand Ballroom, 3F, Grand Luxe Banquet
Advised bySEMI Packaging & Testing Committee FOPLP Working Group
Forum ChairDr. Yu-Hua Chen｜Vice President｜UMTC
Organizer
Sponsored by
Registration Fees (Tax Included)
Period
SEMI Member
Non-member
Super Early-Bird
5/20 - 6/17
SEMI Member
NT$ 2,132
Non-member
NT$ 2,793
Early-Bird
6/18 - 8/5
SEMI Member
NT$ 2,436
Non-member
NT$ 3,192
Regular
8/6 - 8/30
SEMI Member
NT$ 3,045
Non-member
NT$ 3,990
On-Site
8/31 - 9/4
SEMI Member
NT$ 3,959
Non-member
NT$ 5,187
Student
EMBA Excluded
Valid Student ID Required
NT$ 882
Day Pass
(Tax Included)
1 DayNT$ 13,755
2 DaysNT$ 26,040
3 DaysNT$ 36,960
4 DaysNT$ 46,515
5 DaysNT$ 54,915
Group Registration (available until August 19): Register 3 or more participants, or register for more than 3 forums hosted by SEMI Taiwan, to receive a 15% discount on each purchase.
* The organizer reserves the right to adjust or change the agenda. The final agenda is subject to the on-site arrangement.
