FOPLP Innovation Forum - HIGS Series Event

The FOPLP Innovation Forum, under the theme “System Scaling in FOPLP: Integrating Materials, Processes, and Equipment,” explores the next stage of Fan-Out Panel Level Packaging evolution. As AI and HPC continue to drive rapid advancements in computing architectures, FOPLP is evolving from a standalone packaging technology into a critical platform for system-level scaling, enabling higher compute density, increased memory bandwidth, and improved energy efficiency. Through continuous breakthroughs in advanced materials, fine-pitch process integration, panel-level manufacturing, and high-precision equipment capabilities, the industry is accelerating toward larger panel sizes, higher yields, and greater system complexity, while fostering cross-supply-chain collaboration to position FOPLP as a foundational enabler for next-generation AI and HPC architectures.