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Advanced Testing Forum

Thursday, September 3 | 9:00 am - 4:00 pm
Theme

From Silicon to System: Redefining Reliability in the AI Age

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Overview

As AI is driving greater system complexity, reliability is no longer a device-level metric, it must be addressed end to end, requiring closer collaboration across the semiconductor value chain—from silicon innovation to system deployment.​

The 2026 Advanced Testing Forum, themed “From Silicon to System: Redefining Reliability in the AI Age,” will explore how testing is transforming into a strategic enabler across this ecosystem. As technologies such as chiplets, high-bandwidth memory, and high-power AI systems accelerate innovation, testing must move upstream and connect more closely across design, manufacturing, and system-level validation.​

Bringing together leaders across the semiconductor, system, and AI ecosystems, the forum will serve as a platform for dialogue, alignment, and collaboration. It will highlight the growing role of testing in building the reliable foundation needed for the next wave of AI technologies.

Organizer
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Registration Fees (Tax Included)

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Period
SEMI Member
Non-member
Super Early-Bird
5/20 - 6/17

SEMI Member

NT$ 3,308

Non-member

NT$ 4,337
Early-Bird
6/18 - 8/5

SEMI Member

NT$ 3,780

Non-member

NT$ 4,956
Regular
8/6 - 8/30

SEMI Member

NT$ 4,725

Non-member

NT$ 6,195
On-Site
8/31 - 9/4

SEMI Member

NT$ 6,143

Non-member

NT$ 8,054
Student
EMBA Excluded
Valid Student ID Required
NT$ 882
Day Pass
(Tax Included)
1 DayNT$ 13,755
2 DaysNT$ 26,040
3 DaysNT$ 36,960
4 DaysNT$ 46,515
5 DaysNT$ 54,915
Group Registration (available until August 19): Register 3 or more participants, or register for more than 3 forums hosted by SEMI Taiwan, to receive a 15% discount on each purchase.
* The organizer reserves the right to adjust or change the agenda. The final agenda is subject to the on-site arrangement.

Featured Speakers

Mr. Morris D.Y. Chang

Mr. Morris D.Y. Chang

Vice President, King Yuan Electronics Corp.

Keynote Speaker

Mr. Jian Ting Chen

Mr. Jian Ting Chen

Department Manager, TSMC

Speaker

Mr. Siddhartha Goutham Murali

Mr. Siddhartha Goutham Murali

Product Manager, AI & Software Platform, Advantest Europe GmbH

Speaker

Mr. Don Edenfeld

Mr. Don Edenfeld

Test Cell Solution Architect, Teradyne

Speaker

Mr. Daniel Stickler

Dr. Daniel Stickler

Director X-ray Technology & Components, Comet AG

Speaker

Mr. Vivek Khanzodé

Mr. Vivek Khanzodé

Vice President of Engineering, Ayar Labs

Keynote Speaker

Mr. Dave Armstrong

Mr. Dave Armstrong

Fellow, ISE Labs, a subsidiary of ASE, Inc.

Speaker

Mr. Oscar Lee

Mr. Oscar Lee

Technical Manager, TSMC

Speaker

Dr. Collins Sun

Dr. Collins Sun

Technical Director, WinWay Technology Co., Ltd.

Speaker

Agenda

Registration

9:00 am - 9:30 am

Welcome Remarks

Mr. Harry H. Chen

MediaTek Inc.
9:30 am - 9:35 am

Opening Remarks

Dr. Lisa Chen

NXP Semiconductors
9:35 am - 9:40 am

Keynote: Testing at Scale for the AI Era: From Silicon Complexity to System-Level Reliability

Mr. Morris D.Y. Chang

King Yuan Electronics Corp.
9:40 am - 10:20 am

AI-Driven Shift Left: Navigating Critical Test Challenges

Mr. Jian Ting Chen

TSMC
10:20 am - 11:00 am

From Assistive to Autonomous: Building a Verifiable AI Environment for Test Engineering Workflows

Mr. Siddhartha Goutham Murali

Advantest Europe GmbH
11:00 am - 11:25 am

Break Time

11:25 am - 11:35 am

Advancing Test to Enable Advanced Packaging Roadmaps

Mr. Don Edenfeld

Teradyne
11:35 am - 12:00 pm

From Hidden Defects to Reliable Systems: Dose-Aware X-ray Inspection and Metrology for Advanced Packaging in the AI Age

Dr. Daniel Stickler

Comet AG
12:00 pm - 12:25 pm

Lunch Break

12:25 pm - 1:50 pm

Opening Remarks

Mr. Roger Hwang

ASE Inc.
1:50 pm - 1:55 pm

Keynote: Productizing TeraPHY Optical Engines – Challenges & Opportunities

Mr. Vivek Khanzodé

Ayar Labs
1:55 pm - 2:35 pm

The State of the Art in Photonic Device Testing

Mr. Dave Armstrong

ISE Labs, a subsidiary of ASE, Inc.
2:35 pm - 3:00 pm

HPC/AI Device Testing: Bridging Gaps with Integrated Solutions

Mr. Oscar Lee

TSMC
3:00 pm - 3:25 pm

Redefining Reliability through Design for Testing: Decoding Failure Mechanisms in Next-Gen AI Testing

Dr. Collins Sun

WinWay Technology Co., Ltd.
3:25 pm - 3:50 pm

Closing Remarks

Mr. CJ Hsieh

Cupola360 Inc.
3:50 pm - 4:00 pm

Adjournment​​

4:00 pm