Semiconductor Advanced Inspection and Metrology Forum
Friday, September 4 | 9:00 am - 3:55 pm
Theme
Enabling Next-Generation Semiconductor Manufacturing with AI & Advanced Inspection & Metrology
Advised bySEMI Inspection and Metrology Committee
Organizer
Sponsored by
Registration Fees (Tax Included)
Period
SEMI Member
Non-member
Super Early-Bird
5/20 - 6/17
SEMI Member
NT$ 3,308
Non-member
NT$ 4,337
Early-Bird
6/18 - 8/5
SEMI Member
NT$ 3,780
Non-member
NT$ 4,956
Regular
8/6 - 8/30
SEMI Member
NT$ 4,725
Non-member
NT$ 6,195
On-Site
8/31 - 9/4
SEMI Member
NT$ 6,143
Non-member
NT$ 8,054
Student
EMBA Excluded
Valid Student ID Required
NT$ 882
Day Pass
(Tax Included)
1 DayNT$ 13,755
2 DaysNT$ 26,040
3 DaysNT$ 36,960
4 DaysNT$ 46,515
5 DaysNT$ 54,915
Group Registration (available until August 19): Register 3 or more participants, or register for more than 3 forums hosted by SEMI Taiwan, to receive a 15% discount on each purchase.
* The organizer reserves the right to adjust or change the agenda. The final agenda is subject to the on-site arrangement.
Featured Speakers
Agenda
Keynote: Challenges and Opportunities for Metrology and Inspection of Advanced Packaging
Dr. Zhihua Zou
TSMC
9:45 am - 10:25 am
Materials and Chemical Metrology to Enable the Semiconductor Industry
Dr. R. Joseph Kline
National Institute of Standards and Technology
10:25 am - 10:50 am
X-Ray Technology for Advanced Semiconductor Manufacturing
Dr. Wei-En Fu
Industrial Technology Research Institute
11:05 am - 11:30 am
Laser-driven secondary sources for next-gen Metrology
Dr. Torsten Mans
TRUMPF Laser SE
2:00 pm - 2:25 pm
In-Line 3D SEM Metrology and Inspection for Technology Inflections in Memory, Logic and Advanced Packaging
Mr. Nimrod Shuall
Thermo Fisher Scientific
2:40 pm - 3:05 pm