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Smart Manufacturing Forum

Tuesday, September 1 | 8:40 am - 4:45 pm
Theme

Defining the Next Generation of Autonomous Manufacturing

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Overview

2026 Smart Manufacturing Forum, themed “Defining the Next Generation of Autonomous Manufacturing,” will explore how AI, digital transformation, and intelligent automation are reshaping the future of semiconductor manufacturing. As semiconductor fabs become increasingly complex and data-intensive, the industry is evolving from traditional automation and connected digital manufacturing toward more adaptive, autonomous, and intelligent manufacturing environments powered by AI, Digital Twin, and human-machine collaboration.
Expanding from isolated data systems to plant-wide operational intelligence is a monumental engineering challenge. The factory of the future must continuously evolve with the capability to analyze, predict, and proactively optimize production operations, driving the transition from a “Smart Factory” to a “Thinking Factory.” The deep integration of AI is accelerating this transformation while also requiring robust governance frameworks across supply chain resilience, logistics automation, dashboard visualization, factory digitization, control automation, and intelligent decision-making.
The forum will focus on key manufacturing challenges and enabling capabilities, including manufacturing pain points, yield and throughput optimization, process stability, equipment integration, predictive operations, and the practical value of smart manufacturing adoption as the industry advances toward more autonomous and data-driven manufacturing systems.
The forum will cover three major areas. The first is AI-Driven Manufacturing, including Agentic AI, Generative AI, autonomous process optimization, predictive maintenance, and self-healing systems. The second is Digital Transformation & Governance, focusing on Digital Twin, AI-driven yield optimization, data governance, traceability, and manufacturing analytics. The third is Smart Automation & Robotics, featuring AMR, collaborative robots, cleanroom robotics, remote operations, and lights-out fabs.
Through industry presentations and executive discussions, the forum will bring together semiconductor manufacturers, equipment suppliers, and technology leaders to explore the future roadmap toward autonomous semiconductor manufacturing and next-generation factory intelligence.

Organizer
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Registration Fees (Tax Included)

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Period
SEMI Member
Non-member
Super Early-Bird
5/20 - 6/17

SEMI Member

NT$ 3,308

Non-member

NT$ 4,337
Early-Bird
6/18 - 8/5

SEMI Member

NT$ 3,780

Non-member

NT$ 4,956
Regular
8/6 - 8/30

SEMI Member

NT$ 4,725

Non-member

NT$ 6,195
On-Site
8/31 - 9/4

SEMI Member

NT$ 6,143

Non-member

NT$ 8,054
Student
EMBA Excluded
Valid Student ID Required
NT$ 882
Day Pass
(Tax Included)
1 DayNT$ 13,755
2 DaysNT$ 26,040
3 DaysNT$ 36,960
4 DaysNT$ 46,515
5 DaysNT$ 54,915
Group Registration (available until August 19): Register 3 or more participants, or register for more than 3 forums hosted by SEMI Taiwan, to receive a 15% discount on each purchase.
* The organizer reserves the right to adjust or change the agenda. The final agenda is subject to the on-site arrangement.

Featured Speakers

Dr. Chris Lin

Dr. Chris Lin

Vice President and Chief Information Officer of Corporate Information Technology, TSMC

Keynote Speaker

Dr. Tim Lin

Dr. Tim Lin

Senior Manager, Industrial and Semiconductor Inspection, NVIDIA

Speaker

Mr. Mingyuan Zhao

Mr. Mingyuan Zhao

Sr. Manager, Strategic Marketing, Applied Materials

Speaker

Dr. Joseph Ervin

Dr. Joseph Ervin

Managing Director, Lam Research

Speaker

Mr. Paul Kim

Mr. Paul Kim

Digital Transformation Engineer, Merck

Speaker

Mr. Philippe Reiber

Mr. Philippe Reiber

Global Head of Industrial Sales, Analog Devices Inc.

Speaker

Mr. KOEN DE BACKER

Mr. Koen De Backer

Corporate Vice President, Micron

Keynote Speaker

Mr. Michael Munsey

Mr. Michael Munsey

Global Vice President of the Semiconductor Industry, Siemens USA

Speaker

Dr. Vivek Vishwakarma

Dr. Vivek Vishwakarma

Co-founder, ThirdAI Automation Inc

Speaker

Jing Jing_ST26

Dr. Samuel Liu

Senior Director, All Ring Tech Co., Ltd.

Speaker

Dr. Harald Gossner

Dr. Harald Gossner

Senior Principal Engineer, Intel

Speaker

Mr. Bo Huang

Mr. Bo Huang

Partner, Bain & Company

Speaker

Agenda

Robot Dog Demonstration

ANYmal Robotics
9:10 am - 9:15 am

Keynote: AI Innovation and Value Creation: Driving Future Manufacturing Excellence

Dr. Chris Lin

TSMC
9:15 am - 9:40 am

Agentic Vision AI for Smart Inspection

Dr. Tim Lin

NVIDIA
9:40 am - 10:05 am

From Automation to Autonomy – Agentic AI for Yield Management

Mr. Mingyuan Zhao

Applied Materials
10:05 am - 10:30 am

Improving Yield During High Volume Semiconductor Manufacturing Using AI-Coupled, Physics-Based Digital Twins

Dr. Joseph Ervin

Lam Research
10:40 am - 11:05 am

Agentic AI on Operational Ontology Layer for Autonomous Manufacturing Intelligence

Mr. Paul Kim

Merck
11:05 am - 11:30 am

From Components to Autonomous Fabs: How ADI is Advancing the Future of Semiconductor Manufacturing

Mr. Philippe Reiber

Analog Devices Inc.
11:30 am - 11:55 am

Keynote: TBC

Mr. Koen De Backer

Micron
1:40 pm - 2:05 pm

AI-Driven Insights: Turning Data into Fab Performance

Mr. Michael Munsey

Siemens USA
2:05 pm - 2:30 pm

From Correlation to Causation: Causal AI for Root Cause Analysis in Semiconductor Manufacturing

Dr. Vivek Vishwakarma

ThirdAI Automation Inc
3:05 pm - 3:30 pm

From Precision Equipment to Autonomous Manufacturing: Building Trusted Loops for Advanced Packaging

Dr. Samuel Liu

All Ring Tech Co., Ltd.
3:30 pm - 3:55 pm

Semiconductor-X – A Secure and Interoperable Data Ecosystem using Digital Twins for Semiconductor Supply Chain Use Cases

Dr. Harald Gossner

Intel
3:55 pm - 4:20 pm

From Automation to Autonomy: Adoption Blueprints and Investment Map for Intelligent Robotics in the Fab

Mr. Bo Huang

Bain & Company
4:20 pm - 4:45 pm