Keynote: Expand AI with Leadership Silicon & System Integration

9:10 am - 9:40 am

The AI revolution is moving faster than Moore’s Law. With compute demand skyrocketing, industry is at a crossroads: how do we close the gap between silicon limits and AI compute needs? The answer lies in a paradigm shift from "one-dimensional" scaling to "multi-level" integrations. This presentation outlines a roadmap for the future of AI infrastructure, focusing on the power of advanced technology, advanced packaging, and system-wide orchestration. By leveraging TSMC leading node silicon and TSMC 3DFabric platform to unify components at both the chip level and the system level, we can unlock the performance required for the next era of AI. Join us as we discuss why the future of innovation is no longer only about individual chips, it’s about how the entire system is working together cohesively and efficiently.

Key Technologies Covered

AI Mega Trend
Challenges & Opportunities
TSMC Solutions & Call for Action

Featured Speakers

Ms. April Li

Director, TSMC

April Li is the Global Head of AI and HPC (High-Performance Computing) Business Development at TSMC. She’s responsible for driving hypergrowth in the AI/HPC segment through integrated platform roadmaps, global business strategies, and deep customer and ecosystem partner engagements.

With decades of semiconductor leadership, Ms. Li previously served as GM and Head of the Semiconductor Industry at Capgemini. She also spent years at Intel, holding executive roles including Senior Director of Global Sales & Business Development and Director of Engineering Program Management. Throughout her career, she has spearheaded cross-functional alliances that scaled multibillion-dollar products and systems globally. Ms. Li holds a Master of Science in Electrical Engineering and Physics from Cornell University and an MBA from the University of Chicago Booth School of Business.