Powering the Next Phase of AI: Advanced Nodes, Next-Generation Silicon, and Supply Chain Transformation
As AI advances toward agentic systems, it is evolving from passive, single-model responses into a new computing paradigm capable of autonomous planning, tool use, collaboration, and complex task execution. This shift will significantly increase demand for computing power, memory, interconnects, storage, and energy efficiency, accelerating innovation in chip architectures, advanced process nodes, and packaging. The rapid expansion of AI infrastructure will also reshape the semiconductor and ICT supply chain, shifting competition from individual chip performance toward system-level integration, capacity planning, and supply chain resilience. This presentation will explore the evolution of next-generation and agentic AI, its implications for future computing requirements, and how semiconductor innovation will enable this transformation and redefine the industry ecosystem.
Key Technologies Covered
- The next wave AI
- Agentic AI
- Advanced node technology
- Advanced packaging
- Memory
- AI chip
- AI supply chain