Optics for Advanced Chip Manufacturing

2:00 pm - 2:25 pm

Optics as the indispensable core technology for structuring advanced chips has seen an impressive improvement in resolution, driven by smaller wavelength, higher NA, and further process improvements. This development has been accompanied by increased productivity of scanners, leading to record values in data transfer.

We will review current developments in these two directions.

In addition, there arise new challenges for optics as electronic systems are getting larger,

from structuring large substrates and from bonding with tight overlay specifications.

Key Technologies Covered

Lithography Optics
High NA and Hyper NA
Immersion
I-Line

Featured Speakers

Dr. Heiko Feldmann

Head of Roadmap SMT / Senior Principal, ZEISS SMT

Heiko Feldmann, Ph.D. joined ZEISS in 2001 for optical design and simulation. He further worked on technology and product roadmaps, observing device trends, exploring customer requirements, and initiating product and technology developments. In 2022 he was appointed Senior Principal.

His background is theoretical physics, with an M.A. from Stony Brook University (NY) and a Ph.D. from Würzburg University (Germany). He still is fascinated by new ideas and discoveries that further push out our technological and economical limits.