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Advancing Materials Innovation Velocity with AI

9:40 am - 10:05 am

The rapid scaling of AI applications is placing unprecedented demands on semiconductor materials for advanced chips, compressing development timelines and restricting trial-and-error discovery. Conventional approaches to materials R&D — siloed data, manual knowledge retrieval, and low-throughput experimentation — are no longer sufficient to keep pace. Merck Electronics addresses this challenge through Materials Intelligence™ Solutions. By converging AI with materials science, we create a solution platform that integrates high-throughput process development, advanced metrology, and data-enabled AI to accelerate lab-to-fab learning.

 

In this talk, we will present an overview of our approach, including standardization of experimentation; an in-house large language model (LLM) for retrieval over proprietary reports and a materials knowledge graph to surface institutional know-how with provenance and access controls; Machine-learned interatomic potentials (MLIPs) enabled large-scale simulations; and Machine Learning (ML) guided experimentation that creates a Materials AI co-scientist to accelerate discovery toward sustainable, high-yield paths for next-generation AI hardware. Together, these capabilities close the lab-to-fab learning loop faster than any single tool can achieve alone — accelerating the delivery of next-generation materials for AI hardware at the speed the industry demands.

 

Key Technologies Covered

  • Converging AI with materials science 
  • High-throughput process development
  • Advanced metrology
  • Data enabled AI
  • Large language model (LLM)
  • Machine-learned interatomic potentials (MLIPs)
  • Machine Learning (ML) guided experimentation to accelerate materials discovery

Featured Speakers

Dr. Surésh Rajaraman

Dr. Surésh Rajaraman

Chief Technology Officer, Merck

Surésh Rajaraman is the Chief Technology Officer at Merck Electronics. In this role, he actively drives the company’s innovation pipeline and technology roadmap in close collaborations with customers and partners in the ecosystem. Prior to this role, Dr. Rajaraman was the Head of Thin Films and Interim Head of Formulations and the Commercial Leadership Board in the company. He has over 25 years of experience working in the industry while residing in various regions, including the US, Taiwan and Germany. He holds a Ph.D. in Polymer Chemistry from Rensselaer Polytechnic Institute in New York, USA, as well as a master's degree in Polymers from the University of Madras, India. He has authored/coauthored 17 journal publications, 2 book chapters, and is named as inventor/coinventor on more than 25 patents.