Challenges for CPO Testing
3:30 pm - 3:55 pm
The needs for higher bandwidth, shorter latency and lower power consumption make CPO an inevitable path for AI data center. However, compared to conventional pure digital or mix signal testing, the added optical related tests, known as Insertion tests, bring unique challenges which are new to semiconductor industry.
This talk elaborates the different phase of Insertion tests of CPO to give audiences general concepts about the key test challenges ahead.
Key Technologies Covered
- Electrical Connectivity - Fine Pitch Probing
- Optical Connectivity – Light Coupling, FAU Connection/Cleaning/Inspection
- Thermal Conditional – Dual Zone Control
- DUT Handling