TESCAN FemtoChisel™: From Hours to Minutes: High-Throughput Gas-Assisted Femtosecond Laser Workflows for Advanced Semiconductor Analysis and Characterization

As semiconductor devices continue to evolve toward chiplet architectures, heterogeneous integration, advanced packaging, HBM, and wide-bandgap power devices, conventional sample preparation techniques are increasingly challenged by larger structures, complex material stacks, and the need for rapid turnaround.

This workshop introduces the TESCAN FemtoChisel™, a next-generation gas-assisted femtosecond laser platform designed to dramatically accelerate sample preparation while preserving the structural integrity of today's most advanced semiconductor devices.

Participants will discover how FemtoChisel enables fast, precise, and damage-controlled workflows for cross-sectioning, decapsulation, delayering, cavity preparation, and large-volume material removal. The presentation will demonstrate how gas-assisted femtosecond laser processing significantly reduces preparation time while maintaining the quality required for subsequent high-resolution characterization.

Attendees will gain practical insights into how intelligent laser processing can increase laboratory throughput, reduce time-to-answer, and enable more efficient semiconductor characterization across R&D, process engineering, and high-volume manufacturing environments.