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星期四, 九月 3 | 上午 9:00 - 下午 4:00
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From Silicon to System: Redefining Reliability in the AI Age

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As AI is driving greater system complexity, reliability is no longer a device-level metric, it must be addressed end to end, requiring closer collaboration across the semiconductor value chain—from silicon innovation to system deployment.​

The 2026 Advanced Testing Forum, themed “From Silicon to System: Redefining Reliability in the AI Age,” will explore how testing is transforming into a strategic enabler across this ecosystem. As technologies such as chiplets, high-bandwidth memory, and high-power AI systems accelerate innovation, testing must move upstream and connect more closely across design, manufacturing, and system-level validation.​

Bringing together leaders across the semiconductor, system, and AI ecosystems, the forum will serve as a platform for dialogue, alignment, and collaboration. It will highlight the growing role of testing in building the reliable foundation needed for the next wave of AI technologies.

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5/20 - 6/17

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NT$ 4,337
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6/18 - 8/5

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原價
8/6 - 8/30

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NT$ 4,725

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NT$ 6,195
現場價
8/31 - 9/4

SEMI 會員

NT$ 6,143

非會員

NT$ 8,054
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NT$ 882
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5日NT$ 54,915
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Featured Speakers

Mr. Morris D.Y. Chang

張登堯

副總經理, 京元電子股份有限公司

Keynote Speaker

Mr. Jian Ting Chen

陳建廷

部門經理, 台積公司

Speaker

Mr. Siddhartha Goutham Murali

Mr. Siddhartha Goutham Murali

Product Manager, AI & Software Platform, Advantest Europe GmbH

Speaker

Mr. Don Edenfeld

Mr. Don Edenfeld

Test Cell Solution Architect, Teradyne

Speaker

Mr. Daniel Stickler

Dr. Daniel Stickler

Director X-ray Technology & Components, Comet AG

Speaker

Mr. Vivek Khanzodé

Mr. Vivek Khanzodé

Vice President of Engineering, Ayar Labs

Keynote Speaker

Mr. Dave Armstrong

Mr. Dave Armstrong

Fellow, ISE Labs, a subsidiary of ASE, Inc.

Speaker

Mr. Oscar Lee

李奕德

技術副理, 台積公司

Speaker

Dr. Collins Sun

孫家彬博士

技術處長, 穎崴科技股份有限公司

Speaker

Agenda

Registration

上午 9:00 - 上午 9:30

Welcome Remarks

陳海力

聯發科技股份有限公司
上午 9:30 - 上午 9:35

Opening Remarks

陳麗如博士

NXP Semiconductors
上午 9:35 - 上午 9:40

Keynote: Testing at Scale for the AI Era: From Silicon Complexity to System-Level Reliability

張登堯

京元電子股份有限公司
上午 9:40 - 上午 10:20

AI-Driven Shift Left: Navigating Critical Test Challenges

陳建廷

台積公司
上午 10:20 - 上午 11:00

From Assistive to Autonomous: Building a Verifiable AI Environment for Test Engineering Workflows

Mr. Siddhartha Goutham Murali

Advantest Europe GmbH
上午 11:00 - 上午 11:25

Break Time

上午 11:25 - 上午 11:35

Advancing Test to Enable Advanced Packaging Roadmaps

Mr. Don Edenfeld

Teradyne
上午 11:35 - 下午 12:00

From Hidden Defects to Reliable Systems: Dose-Aware X-ray Inspection and Metrology for Advanced Packaging in the AI Age

Dr. Daniel Stickler

Comet AG
下午 12:00 - 下午 12:25

Lunch Break

下午 12:25 - 下午 1:50

Opening Remarks

Mr. Roger Hwang

ASE Inc.
下午 1:50 - 下午 1:55

Keynote: Productizing TeraPHY Optical Engines – Challenges & Opportunities

Mr. Vivek Khanzodé

Ayar Labs
下午 1:55 - 下午 2:35

The State of the Art in Photonic Device Testing

Mr. Dave Armstrong

ISE Labs, a subsidiary of ASE, Inc.
下午 2:35 - 下午 3:00

HPC/AI Device Testing: Bridging Gaps with Integrated Solutions

李奕德

台積公司
下午 3:00 - 下午 3:25

Redefining Reliability through Design for Testing: Decoding Failure Mechanisms in Next-Gen AI Testing

孫家彬博士

穎崴科技股份有限公司
下午 3:25 - 下午 3:50

Closing Remarks

謝承儒

Cupola360 Inc.
下午 3:50 - 下午 4:00

Adjournment​​

下午 4:00