Dr. Harrison Chang

Dr. Harrison Chang is responsible for co-design System-in-Package with customers and meet application specific requirement.  He has been working on the heterogeneous integration for applications including

• powerSiP® for HPC packages
• Automotive power electronics
• Smart phone and wearable SiP
• High speed electronic, AI in IoT
• WWAN/WLAN modem SiP
• 5G and beyond system
• mmWave antenna-in-package
• Using AI/ML on RF design
• Bio-sensing on flexible 3D SiP 

Power development is one of the most critical issues in the era of AI . Whether it is power generation, energy storage, computational efficiency, or thermal management, all of these aspects require innovative solutions at the system and packaging levels. I look forward to working with Members of the industry in various roles to discuss and develop short-medium and long-term strategies to tackle these key technology challenges.