Scaling Additive High-Resolution Copper Interconnects for High Volume Panel Level Packaging
AI and high performance computing are driving demand for finer pitch copper redistribution layers, placing Panel Level Packaging at the centre of next generation advanced packaging. However, current manufacturing approaches face significant challenges in scaling below 2 micrometre line and space while maintaining throughput, yield, panel uniformity and cost competitiveness.
This presentation examines the manufacturing roadmap for copper RDL scaling in Panel Level Packaging, with a focus on the barriers to high volume adoption. These include panel warpage, increasing process complexity, alignment across large areas and the tradeoff between resolution and throughput.
We present Localized Electrochemical Manufacturing (LEM), a process that combines patterning and copper deposition into a single manufacturing step. Mechanically compliant stamps conform to panel topography, supporting pattern fidelity across large format panels and reducing sensitivity to warpage. The approach enables high resolution copper interconnects without stitching across panels and provides a pathway toward 1 micrometre RDL at production relevant throughput.
Compared with conventional semi additive processing, LEM reduces the number of major process steps from 18 to 12. This simplifies the manufacturing flow, reduces process complexity and creates a scalable pathway for to extend Panel Level Packaging to higher density AI and HPC applications.
Key Technologies Covered
- Localized Electrochemical Manufacturing
- RDL
- Panel Level Packaging
- Additive Manufacturing
