Wafer-Level Precision at Panel Scale: Advancing Plating & Wet Processes for FOPLP Yield and HVM
Fan-Out Panel-Level Packaging (FOPLP) is moving from promise to practice as the industry seeks a scalable path to higher area efficiency and larger AI package. Yet the transition from 300 mm wafers to large-format panels amplifies the hardest problems in electroplating and wet processing: maintaining within-panel thickness and profile control, managing edge/corner effects, controlling chemistry and contamination, and sustaining yield under warpage and high-throughput manufacturing demands.
In this talk, we share Lam’s perspective on bringing wafer-proven plating and wet-process discipline to panel-scale manufacturing. We discuss the key physics that change with scale (electric-field uniformity, mass transport, and feature-density loading) and the tool- and process-design approaches required to replicate wafer-level performance on panels. We also highlight how modeling, simulation, and data-driven development can accelerate learning cycles and tighten process windows—enabling faster ramp to stable, repeatable production.
Key Technologies Covered
- Panel-level packaging
- Advanced substrate
- Equipment intelligent
- Simulation for process optimization
- Wet process
- Electroplating
- RDL
- TGV process
