Plasma and laser applications in the semiconductor value chain with a focus on glass panel process for advanced packaging

3:40 pm - 4:05 pm

Precision and efficiency are the two major elements of semiconductor wafer fabrication, and with over-hundred-year-history TRUMPF combines its laser technology and plasma power supply cutting-edge technology to provide a full range of solutions for advanced packaging, reducing costs and increasing efficiency, and achieving AI-driven market expansion with revenue growth for enterprises.

Glass is an enabling material for modern chips: its low dielectric loss, dimensional and thermal stability, and compatibility with micrometer-scale features make it ideal for high-density interconnects and panel-scale manufacturing. Laser and plasma methods together form the core of scalable glass panel processing. Ultra-short pulse lasers enable precise, contactless modification of glass for high-aspect-ratio vias and fine structures with minimal thermal damage, supporting micrometer-scale vias and high via densities across large panels. Complementary plasma processes provide controlled material removal, surface functionalization and contamination-free interfaces essential for reliable metallization and assembly. Together, laser and plasma solutions deliver the accuracy, throughput and surface quality required to scale glass interposers and glass-core substrates from R&D to high-volume manufacturing in next-generation heterogeneous packaging.

 

Key Technologies Covered

  • EUV, plasma and laser processes in semiconductor value chain
  • CVD, MOCVD, PVD and plasma etch processes
  • Ultra-short pulse laser modification of glass panels
  • High-Impulse Magnetron Sputtering process enabling TSV/TGV filling

Featured Speakers

Mr. Schneider Yannick

Mr. Yannick Schneider

Head of Solution Center Emerging Markets, TRUMPF Huettinger

Yannick Schneider is in his role as ‘Head of Solution Center Emerging Markets’ responsible for the global sales activities at TRUMPF Electronics for the markets industrial heating, energy storage, radar/space and particle accelerators as well as any other nascent technologies and applications. With more than 13 years at TRUMPF, he has hold various roles in technical sales, project management and industry management. With the wide product portfolio at TRUMPF Electronics, he is together with his team supporting the industry for any heating and plasma application using power supplies ranging from DC to GHz.