Advanced Patterning in FOPLP: A Scalable Digital Lithography Platform and Co-Optimized Process Integration

2:15 pm - 2:40 pm

Semiconductor roadmaps are increasingly set by system-level drivers such as artificial intelligence (AI), advanced wireless connectivity, and autonomous vehicles. The high-performance computing (HPC) hardware behind these applications requires not only logic scaling but also larger package sizes and advanced 3D integration. Furthermore, to realize higher I/O density, lower signal delay, and improved power efficiency, the entire package stack must scale together, from the PCB to the interposer and the silicon die. This increasing complexity cannot be resolved at any single layer of the stack; it requires materials, processes, and equipment to be co-optimized. For panel-level patterning, the immediate consequences are finer RDL geometries, tighter overlay budgets, and reduced tolerance for substrate-induced variation. Applied Materials addresses these requirements across all three domains, with enabling materials and processes supported by a portfolio of patterning, deposition, and metrology/test equipment for FOPLP system scaling and next-generation packaging architectures.

These requirements surface first at the materials and process level. Organic substrates commonly used in panel-level packaging warp during thermal processing, causing in-plane distortion after chucking. Stacked dielectric materials also introduce surface roughness and topography variation, which degrade pattern fidelity and reduce focus margin. In addition, integrating more chiplets into a single package increases package size, creating stitching regions between exposure shots in conventional mask-based lithography and degrading overlay performance due to die misplacement.

At the equipment level, these material and process constraints are addressed by a digital lithography tool (DLT) platform incorporating high-speed real-time autofocus, pixel blending technology, unit-based alignment correction, and Digital Dynamic Connection (DDC). These technologies enable compensation of topography-induced defocus, mitigation of stitching defects, correction of local substrate distortion, and adaptive connection of displaced embedded dies. DLT provides a flexible and scalable lithography solution for high-volume production of advanced packaging. The presentation closes by situating DLT within Applied Materials’ broader FOPLP portfolio, illustrating how materials, process, and equipment decisions must be developed together to make panel-level system scaling manufacturable at high volume.

Key Technologies Covered

Maskless digital lithography (DLT) for panel-level advanced patterning
High-speed real-time autofocus to compensate topography-induced defocus
Pixel blending for stitch-free exposure across large panel formats
Unit-based alignment correction for local substrate distortion
Digital Dynamic Connection (DDC) — adaptive routing to displaced embedded dies
Fine-line RDL patterning on organic panel substrates
Panel warpage and in-plane distortion management (thermal processing, chucking)
Dielectric stack and surface topography control for pattern fidelity and focus margin
Overlay metrology and process control for panel-level packaging
Co-optimized materials–process–equipment integration for FOPLP high-volume manufacturing

Featured Speakers

Dr. Anant Chimmalgi

General Manager, Applied Materials

Anant Chimmalgi is an accomplished technology executive with more than two decades of leadership across semiconductor capital equipment, advanced manufacturing, and high-growth technology companies. As General Manager of the Digital Lithography Group at Applied Materials, he leads a global organization spanning engineering, operations, and supply chain, with full accountability for the group’s products, execution, and business results. A customer-focused leader with a growth mindset, Anant is scaling the business and accelerating high-volume manufacturing (HVM) adoption of the group’s technology, while building high-performing teams that consistently deliver critical products and operational outcomes.

Prior to Applied Materials, Anant served as Vice President of Systems and Optics at Carbon, a late-stage additive manufacturing company, where he was instrumental in scaling the organization and driving execution through a period of rapid growth and commercialization. Earlier in his career, he spent nearly a decade at KLA-Tencor in progressively senior engineering and program management leadership roles, developing deep expertise in optical patterned wafer inspection and execution at scale. Recognized for his operational discipline, strategic vision, and ability to align technology, people, and business objectives, Anant combines technical depth with commercial acumen to deliver results in complex, high-stakes environments.