Elephantech

 

Elephantech為日本深度科技企業，專注於先進奈米銅材料與加乘法製造技術，提供次世代半導體封裝與電子產品解決方案。憑藉自主研發奈米銅材料與AI精密噴墨印刷技術，開發高深寬比通/盲孔金屬化、玻璃基板對接及高效散熱等創新技術，協助半導體製造商、封測、載板廠及設備商提升良率、降低成本，推動先進封裝的永續發展。

 

技術亮點

• DeepVia™ – High-aspect-ratio via metallization solutions for HDI and 3D semiconductor integration.
• SAphire™ – Copper nanopaste platform for TGV filling, die attach, TIM, and advanced interconnect applications.
• DS-SAP™ – Dual-Seed Semi Additive Process for high-density semiconductor package substrates.
• Self-Assembling Copper Nanoparticles (SA-CuNP™) – Proprietary nanomaterial platform enabling next-generation copper metallization.
• Precision Inkjet Manufacturing Platform – AI-enabled copper deposition technology for scalable semiconductor manufacturing.