Elephantech

 

Elephantech is a Japan-based deep-tech startup developing advanced copper materials and additive manufacturing technologies for next-generation semiconductor packaging and electronics. Leveraging proprietary copper nanoparticle synthesis, AI-controlled precision printing, and innovative metallization processes, we provide solutions that address critical challenges in advanced packaging, including high-aspect-ratio via metallization, glass substrate interconnects, and high-performance thermal management. Our technologies, including DeepVia™ Seed Repair and the SAphire™ copper materials platform, are designed to improve manufacturing yield, enhance electrical performance, and reduce production costs while enabling more sustainable semiconductor manufacturing. By combining cutting-edge materials science with scalable manufacturing technologies, Elephantech aims to become a strategic technology partner for semiconductor manufacturers, OSATs, substrate suppliers, and equipment companies worldwide

 

Technology Highlights

• DeepVia™ – High-aspect-ratio via metallization solutions for HDI and 3D semiconductor integration.
• SAphire™ – Copper nanopaste platform for TGV filling, die attach, TIM, and advanced interconnect applications.
• DS-SAP™ – Dual-Seed Semi Additive Process for high-density semiconductor package substrates.
• Self-Assembling Copper Nanoparticles (SA-CuNP™) – Proprietary nanomaterial platform enabling next-generation copper metallization.
• Precision Inkjet Manufacturing Platform – AI-enabled copper deposition technology for scalable semiconductor manufacturing.