Advanced CMP Pad Engineering for Enabling Next-Generation AI Chip Planarization

下午 2:50 - 下午 3:15

The rapid advancement of AI and high-performance computing is driving significant changes in semiconductor device architecture, including advanced logic scaling, 3D integration, and heterogeneous packaging. These trends place unprecedented demands on chemical mechanical planarization (CMP), where achieving high planarization efficiency, ultra-low defectivity, and tight uniformity has become increasingly challenging.

CMP pads play a critical role in controlling surface interactions, slurry transport, and mechanical response during polishing. However, conventional pad designs are approaching fundamental limitations under advanced process conditions. Key challenges include maintaining removal rate stability over pad life, minimizing defectivity caused by slurry non-uniformity and debris accumulation, and controlling wafer-scale non-uniformity such as edge profile variations. In addition, the highly dynamic coupling of contact mechanics, hydrodynamics, and pad wear makes process optimization increasingly complex and less predictable. These issues are further amplified by the introduction of new materials and integration schemes for AI chips.

To address these challenges, a combined approach of simulation-driven development and advanced material engineering is being pursued. Physics-based models, including computational fluid dynamics (CFD) and modified removal rate formulations, provide insights into slurry flow behavior and pad–wafer interactions. Experimental platforms and diagnostic tools enable validation of these models, supporting a more predictive understanding of CMP processes.

In parallel, pad material innovations focus on tuning surface energy, pore structure, and mechanical properties to enhance performance. Controlled pore morphology improves slurry distribution and debris removal, while optimized surface properties help reduce defectivity and stabilize performance. Integration of groove design, pad architecture, and material formulation further enables improved uniformity and process robustness.

This work highlights recent progress in CMP pad engineering, demonstrating how integrating simulation and material innovation can address critical challenges and enable next-generation AI chip manufacturing.

Key Technologies Covered

Pad–slurry–wafer interaction fundamentals (contact mechanics, hydrodynamics, tribology)
Physics-based CMP modeling (CFD, modified Preston equation, RR prediction)
Pad surface energy engineering for debris mitigation and defect reduction
Advanced polymer and material design (tunable mechanical properties, porosity, texturability)
Integrated pad architecture (top–sub pad synergy, edge profile control, uniformity optimization)
Simulation-driven material development workflow for next-generation CMP pad innovation

Featured Speakers

李公正博士

研發總監, 啟諾迪電子公司

Ivan Li earned his Ph.D. in Mechanical Engineering in 2005, specializing in electrochemistry and materials science. He began his career managing a materials analysis laboratory, where he gained in-depth experience in surface characterization, failure analysis, and materials qualification. Ivan then transitioned to a global chemical supplier as an application engineer, focusing on Copper Damascene electrodeposition and copper plating for semiconductor manufacturing. In this role, he collaborated closely with customers to optimize processes, troubleshoot technical challenges, and facilitate the introduction of new materials into production.

More recently, Ivan has expanded his expertise to chemical mechanical planarization (CMP), concentrating on pad and slurry interactions, surface wetting, and process integration. He has made significant contributions to pad evaluation, slurry compatibility studies, defect reduction, and process optimization in advanced semiconductor applications. Ivan possesses a strong background in product development and application support, with successful introductions of new materials and surface treatment solutions spanning the PCB, electronic components, and semiconductor industries.

With solid foundations in electrochemistry, materials science, and CMP processes, Ivan excels at linking scientific principles with practical manufacturing needs. He is highly skilled at translating technical knowledge into process improvements and tailored customer solutions.