李公正博士

Ivan Li earned his Ph.D. in Mechanical Engineering in 2005, specializing in electrochemistry and materials science. He began his career managing a materials analysis laboratory, where he gained in-depth experience in surface characterization, failure analysis, and materials qualification. Ivan then transitioned to a global chemical supplier as an application engineer, focusing on Copper Damascene electrodeposition and copper plating for semiconductor manufacturing. In this role, he collaborated closely with customers to optimize processes, troubleshoot technical challenges, and facilitate the introduction of new materials into production. 

More recently, Ivan has expanded his expertise to chemical mechanical planarization (CMP), concentrating on pad and slurry interactions, surface wetting, and process integration. He has made significant contributions to pad evaluation, slurry compatibility studies, defect reduction, and process optimization in advanced semiconductor applications. Ivan possesses a strong background in product development and application support, with successful introductions of new materials and surface treatment solutions spanning the PCB, electronic components, and semiconductor industries. 

With solid foundations in electrochemistry, materials science, and CMP processes, Ivan excels at linking scientific principles with practical manufacturing needs. He is highly skilled at translating technical knowledge into process improvements and tailored customer solutions.