Opening Keynote: Heterogeneous Integration for AI Era

上午 9:05 - 上午 9:35

As computational demands surge, traditional monolithic chip with 2D package designs face limitations in scalability, power efficiency and thermal management. Advanced packaging techniques, including 2.5D and 3D integration, offer promising solutions by allowing heterogeneous integration. These innovations not only address power consumption and bandwidth but also provide a scalable path to meet the growing computational needs. This talk will delve into the cutting-edge advancements in packaging and chiplet technologies, emphasizing their pivotal role in enhancing AI and High-Performance Computing (HPC) applications. Additionally, we'll examine the critical aspects of thermal solutions and stress management strategies essential for maintaining performance and reliability in these dense and complex configurations. The discussion will also provide insights into future directions and the significant impact on next-generation computing systems. 

 

Key Technologies Covered

  • Energy efficiency becomes the most important performance index for AI related platforms moving forward
  • Advancement in logic, memory and packaging technology plots a path of continuous density and energy efficiency scaling to meet AI-driven requirements
  • STCO with 3DFabric platform, is a holistic approach to enable tomorrow’s AI with integrated technology platform

Featured Speakers

Dr. James Chen

陳燕銘博士

處長, 台積公司

Yen-Ming Chen (also known as James Chen) is currently the Advanced Package R&D Director at TSMC. He has been with TSMC for over 30 years. His expertise lies in advanced semiconductor technology research, complemented by extensive mass production experience. He has published 11 papers in world-renowned conferences and journals and holds over 170 patents in the semiconductor field, including semiconductor processes, device architecture, standard cell optimization, color filters, and package technology.

Yen-Ming received his Ph.D. in Material Science from National Chiao Tung University in 2005 and his master degree from National Cheng Kung University in 1992.