陳燕銘博士

Yen-Ming Chen (also known as James Chen) is currently the Advanced Package R&D Director at TSMC. He has been with TSMC for over 30 years. His expertise lies in advanced semiconductor technology research, complemented by extensive mass production experience. He has published 11 papers in world-renowned conferences and journals and holds over 170 patents in the semiconductor field, including semiconductor processes, device architecture, standard cell optimization, color filters, and package technology.

Yen-Ming received his Ph.D. in Material Science from National Chiao Tung University in 2005 and his master degree from National Cheng Kung University in 1992.