Keynote Speech: Shrink to Stack — Redefining Semiconductor Innovation in the Angstrom Era

Innovation in semiconductors has moved beyond the chip itself—now, it’s the entire system that drives progress and unlocks new possibilities. 

For more than 50 years, Moore’s Law set the pace. Innovation meant one thing: shrink the transistor, push performance and power further with every generation. Scaling still matters – but the industry is entering a new era. As transistor miniaturization meets physical limits, the next chapter of computing won’t be won by smaller chips alone. We win by how we integrate, connect, and package chips — and by the forces reshaping how that work gets done. 

This is the shift from “shrink” to “stack”; it’s transforming the semiconductor value chain. Advanced packaging, heterogeneous integration, chiplets and 3D architectures are the new frontier — the technologies that unlock the performance, efficiency, and scale that AI and high-performance computing demand. Advanced packaging is racing from $46B to nearly $80B by 2030. It’s no longer invisible infrastructure. It’s the primary launch pad for system-level performance. And as these systems grow more complex, materials for connectivity, managing heat, and maintaining reliability determine whether technology can scale.  

That’s why material innovation begins at the design table, shaping technology roadmaps from the earliest stages. With supply chains being restructured around risk factor priorities as much as technical ones, the ability to collaborate across a more complex, distributed ecosystem is becoming a core necessity. OEMs, chipmakers, materials suppliers, and manufacturing partners are becoming more interconnected and more interdependent than ever. 

In this keynote, Jon Kemp, CEO of Qnity, will explore how the industry’s structural shift from “shrink” to “stack” is redefining semiconductor innovation and value creation across the ecosystem. He will discuss:  

• Why advanced packaging is enabling the angstrom era 
• How materials innovation is becoming a strategic differentiator in next-generation chip design 
• How supply chain strategies are being reshaped and what it means for ecosystem collaboration 
• Why the industry must work across the value chain to accelerate breakthroughs in AI, advanced computing, and semiconductor manufacturing