Keynote Speech: Shrink to Stack — Redefining Semiconductor Innovation in the Angstrom Era

11:00 am - 11:25 am

Innovation in semiconductors has moved beyond the chip itself—now, it’s the entire system that drives progress and unlocks new possibilities.

For more than 50 years, Moore’s Law set the pace. Innovation meant one thing: shrink the transistor, push performance and power further with every generation. Scaling still matters – but the industry is entering a new era. As transistor miniaturization meets physical limits, the next chapter of computing won’t be won by smaller chips alone. We win by how we integrate, connect, and package chips — and by the forces reshaping how that work gets done.

This is the shift from “shrink” to “stack”; it’s transforming the semiconductor value chain. Advanced packaging, heterogeneous integration, chiplets and 3D architectures are the new frontier — the technologies that unlock the performance, efficiency, and scale that AI and high-performance computing demand. Advanced packaging is racing from $46B to nearly $80B by 2030. It’s no longer invisible infrastructure. It’s the primary launch pad for system-level performance. And as these systems grow more complex, materials for connectivity, managing heat, and maintaining reliability determine whether technology can scale.

That’s why material innovation begins at the design table, shaping technology roadmaps from the earliest stages. With supply chains being restructured around risk factor priorities as much as technical ones, the ability to collaborate across a more complex, distributed ecosystem is becoming a core necessity. OEMs, chipmakers, materials suppliers, and manufacturing partners are becoming more interconnected and more interdependent than ever.

In this keynote, Jon Kemp, CEO of Qnity, will explore how the industry’s structural shift from “shrink” to “stack” is redefining semiconductor innovation and value creation across the ecosystem. He will discuss:

Why advanced packaging is enabling the angstrom era
How materials innovation is becoming a strategic differentiator in next-generation chip design
How supply chain strategies are being reshaped and what it means for ecosystem collaboration
Why the industry must work across the value chain to accelerate breakthroughs in AI, advanced computing, and semiconductor manufacturing

Featured Speakers

Mr. Jon Kemp

Chief Executive Officer, Qnity Electronics

Biography

Jon Kemp is Chief Executive Officer for Qnity, a leading global provider of differentiated electronics materials, including key consumables used in semiconductor chip manufacturing, and advanced electronic materials enabling reliable signal integrity, power management and thermal management. Jon also serves on Qnity’s Board of Directors.

As Chief Executive Officer, Jon is responsible for setting and driving Qnity’s strategy and operations to capitalize on transformational market trends, drive organic and inorganic growth, and enable differentiation through innovation.

Jon serves on the International Board of Directors for SEMI, an organization focused on advancing the global semiconductor supply chain, where he Chairs the Board of Industry Leaders.

Highest Education

B.A. in Economics from the University of Utah and his M.B.A. from the Darden School of Business at the University of Virginia.

Professional Experience

Prior to this role, Jon served as president of DuPont’s Electronics & Industrial business. As president, he designed and led business strategy and operations, including a major portfolio transformation to enable growth.

Jon has more than 20 years of experience in key leadership roles, including president of DuPont’s Electronics and Communications business, and global business director for DuPont’s Circuit & Packaging Materials. After the merger of DuPont and Dow in 2017, Jon led strategy and M&A for the newly formed DuPont Specialty Products Division.