From Front-End to Advanced Packaging: Scalable AI-Ready Data Platform, Secure Data Exchange and Ecosystem Collaboration

上午 9:00 - 上午 9:25

As IC design shifts from monolithic SoCs to chiplet-based, heterogeneously integrated systems, the boundary between design and manufacturing is dissolving. 2.5D interposers and CoWoS, hybrid bonding, and 3D stacking introduce yield sensitivities, defect mechanisms, and multi-physics interactions that design teams can no longer treat as a downstream concern. Realizing the promise of chiplet architecture, and the system-level optimization the industry is now pursuing, depends on the ability to securely bring and analyze data from across the design and manufacturing ecosystem. This talk presents PDF Solutions' perspective on how to combine into an integrated operations solution and AI-first data platform, a secure remote data exchange solution and an overall ability to orchestrate processes across the supply chain.

This integrated AI ready operations solution is designed to handle the large data sets of semiconductor manufacturing, through the entire supply chain, from design, through test operations. We first describe the main component of the PDF Solutions Exensio Aurora architecture. Then cover the role of secure data access and exchange across the manufacturing supply chain,

Finally, we address the analytics infrastructure required to operationalize this learning at scale. As advanced packaging adds multiple test insertions and complex die-feed-forward requirements, Exensio's In-line Traceability, Scalable Analytics, and the StudioAI layer enable a more complete approach to adaptive test: rather than static binning rules, AI models trained on correlated die and process histories are continuously updated and deployed across the supply. We show how this differs from legacy adaptive test implementations and what it unlocks for multi-chiplet assemblies, and for the design and system teams that depend on them.

Key Technologies Covered

Advanced Packaging
Chiplet Architectures
Heterogeneous Integration
Design Technology Co-Optimization (DTCO)
AI ready data platform
Data Feed Forward
Adaptive Test
AI-Driven Semiconductor Manufacturing Analytics
Supply Chain Data Integration

Featured Speakers

Dr. Kimon Michaels

Executive VP, Products and Solutions, Director, and Co-Founder, PDF Solutions

Kimon Michaels, Ph.D. Executive Vice President, Products and Solutions, Director, and Co-Founder

Kimon Michaels, Ph.D., one of our founders, has served as Vice President of Products and Solutions since July 2010 and has been a Director since November 1995. Mr. Michaels served as Vice President of Design for Manufacturability from June 2007 through June 2010. Prior to that, Dr. Michaels served as Vice President of Field Operations for Manufacturing Process Solutions from January 2006 through May 2007. From March 1993 through December 2005, he served in various executive capacities. He also served as Chief Financial Officer from November 1995 to July 1998. Dr. Michaels received a B.S. in Electrical Engineering, an M.S. E.C.E. and a Ph.D. E.C.E. from Carnegie Mellon University.