移至主內容

Heterogeneous integration for AI compute

下午 2:00 - 下午 2:20

Heterogeneous integration technology platform enables industry’s best available high performance computing systems for AI training and inferencing, but not without challenges. As HPC system scaling continues, challenges in multiple fronts arose, from system technology co-design, rising process complexity, thermal mitigation, to costs reduction, and to supplier chains integration. Looking forward, ample opportunities arose as the industry work together for future technology advancement.

Featured Speakers

Mr. K.C. Hsu

徐國晉

副總經理, 先進封裝技術發展, 台積公司

徐國晉先生為台積公司先進封裝技術發展副總經理,負責開發台積公司之三維積體電路(3D IC)及先進封裝等系統整合技術。他在半導體業擁有超過30年的豐富經驗。 

徐國晉先生於1986年畢業於國立台灣大學物理系,並於1994年取得國立交通大學科技管理碩士學位。