Mr. K.C. Hsu is Vice President of Integrated Interconnect & Packaging at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for the development of TSMC’s system integration technologies, including 3D IC and advanced packaging. He possesses more than 30 years’ experience in the semiconductor industry.
Mr. K.C. Hsu received his B.S. in Physics from National Taiwan University and his M.S. in Technology Management from National Chiao Tung University.
