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Heterogeneous integration for AI compute

2:00 pm - 2:20 pm

Heterogeneous integration technology platform enables industry’s best available high performance computing systems for AI training and inferencing, but not without challenges. As HPC system scaling continues, challenges in multiple fronts arose, from system technology co-design, rising process complexity, thermal mitigation, to costs reduction, and to supplier chains integration. Looking forward, ample opportunities arose as the industry work together for future technology advancement.

Featured Speakers

Mr. K.C. Hsu

Mr. K.C. Hsu

Vice President, Advanced Packaging Technology Development, TSMC

Mr. K.C. Hsu is Vice President of Advanced Packaging Technology Development at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for the development of TSMC’s system integration technologies, including 3D IC and advanced packaging. He possesses more than 30 years’ experience in the semiconductor industry.

Mr. K.C. Hsu received his B.S. in Physics from National Taiwan University in 1986 and his M.S. in Technology Management from National Chiao Tung University in 1994.