Mr. K.C. Hsu is Vice President of Advanced Packaging Technology Development at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for the development of TSMC’s system integration technologies. He possesses more than 30 years’ experience in the semiconductor industry.
Mr. K.C. Hsu received his B.S. in Physics from National Taiwan University and his M.S. in Technology Management from National Chiao Tung University.
