林基正博士

Dr. Jim Lin currently serves as the Senior Vice President of Advanced Package Technology Development & Operation at Powertech Technology Inc. (PTI) and is a member of the Board of Directors for both PTI and Greatek Electronics Inc. With over 20 years of expertise in IC packaging technology, Dr. Lin spearheads PTI’s R&D and operational strategies, focusing on pioneering next-generation solutions.

Throughout his distinguished career, Dr. Lin has been instrumental in developing advanced technologies, including 32-chip memory stacking, System-in-Package (SiP), Package-on-Package (PoP), and Heterogeneous Multi-Chip Modules (MCP). He has also led significant breakthroughs in 3D TSV interconnection for High Bandwidth Memory (HBM) and Fan-out Panel Level Packaging (FOPLP). Under his leadership, PTI has solidified its position at the forefront of FOPLP innovation, driving industry-wide progress.

Dr. Lin earned his M.S. and Ph.D. in Power Mechanical Engineering from National Tsing Hua University.